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MTC40F2047S1HC88XB1 (Micron)
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| Die Density Gb | 32 |
|---|---|
| Speed Mt S | 8800 |
| Registered | true |
| Capacity Gb | 128 |
| Memory Class | mr_dimm |
| Memory Generation | ddr5 |
| Product Name | 128GB (x80, ECC, DR) 287-Pin DDR5 MRDIMM (DDR5-8800) |
| Cas Latency | |
| Column Address | |
| Component Composition | |
| Internal Banks | |
| Row Address | |
| Vddq |
| Operating temp max (°C) | 95 |
|---|---|
| Operating temp min (°C) | 0 |
| SKU | MTC40F2047S1HC88XB1 |
|---|
| Base part number | |
|---|---|
| Die Revision | |
| Module density | |
| Description | |
| Rank | |
| ECC | |
| Multiplexing | |
| MRCD rank mode | |
| DDR5 functionality | |
| Module data rate | |
| DRAM component data rate | |
| Operating temperature | |
| Operating temperature marking | |
| Frequency/CAS latency marking | |
| Device bank group address | |
| Device bank address per bank group | |
| Device configuration | |
| Module Density | |
| Configuration | |
| Module Bandwidth | |
| Clock Cycles (CL-nRCD-nRP) | |
| Designation | |
| Base device | |
| BUS WIDTH | |
| PART STATUS CODE | |
| MODULE BOX QTY | |
| PACKAGE DIMENSION (W X L X H) MM | |
| NUMBER OF COMPONENTS | |
| PART TYPE | |
| PACKAGE | |
| Product group |
