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MICRON HBM3E (Micron)
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| Ecc | Reed-Solomon on-die ECC |
|---|---|
| Capacity Gb | 24 |
| Product Name | Micron® HBM3E |
| Operating temp max (°C) | 105 |
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| SKU | MICRON HBM3E |
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| Document type | |
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| Product name | |
| Tagline | |
| Data rate | |
| Capacity (8-high cube) | |
| Bandwidth | |
| Performance/watt vs previous generation | |
| Previous generation |
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| Process node |
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| Packaging technology |
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| Interconnect feature |
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| Product highlight – packaging |
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| Product highlight – value vs competitive HBM |
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| Capacity advantage vs competitive HBM |
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| Bandwidth advantage vs competitive HBM |
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| Performance/watt advantage vs competitive HBM |
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| Key feature – RAS |
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| Soft repair |
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| Hard repair |
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| Error check and scrub |
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| Data alignment |
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| Signal/power integrity |
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| Built-in self test |
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| TSV count vs current HBM3 |
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| Capacity |
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| Technology |
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| Form Factor (mm) |
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| Data Range |
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| Burst Length |
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| Channel |
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| Pseudo Channels |
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| Operating Temperature |
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| Efficiency claim |
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| Chart |
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| Product URL |
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| Copyright |
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| Revision |
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| Document number |
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