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BOYD DSC ALUMINUM LIQUID COLD PLATE COOLER (Boyd)
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| Cooler Type | direct_to_chip |
|---|---|
| Application | |
| Fluid Flow Rate Lpm | |
| Product Name |
| SKU | BOYD DSC ALUMINUM LIQUID COLD PLATE COOLER |
|---|
| Product type / description | |
|---|---|
| Cooling structure | |
| LCP construction — layers | |
| Top LCP extra connectors | |
| Interface sealing |
| Manufacturing — layers |
|---|
| Manufacturing — connectors |
|---|
| Manufacturing — turbulators |
|---|
| Bending compensation |
|---|
| Cooler + module volume |
|---|
| Cooler volume (neglecting module volume not in contact with cooler) |
|---|
| CFD simulation tool |
|---|
| Coolant |
|---|
| Coolant density |
|---|
| Coolant specific heat |
|---|
| Coolant conductivity |
|---|
| Coolant viscosity |
|---|
| Inlet Fluid Temperature, Tf |
|---|
| Power Module configuration |
|---|
| Module-A chip content |
|---|
| Module-B chip content |
|---|
| Dissipated Power per switch — Module-A |
|---|
| Dissipated Power per switch — Module-B |
|---|
| Dissipated power note |
|---|
| TIM (CFD boundary condition) |
|---|
| Target Pressure Drop |
|---|
| Simulated pressure drop (with inlet/outlet manifolds) |
|---|
| Ratio of power flow top:bottom [W] |
|---|
| Ratio of power flow top:bottom [%] |
|---|
| Ratio of power flow top:bottom [W] |
|---|
| Ratio of power flow top:bottom [%] |
|---|
| Chip average-temperature, Tvj |
|---|
| Chip average-temperature, Tvj |
|---|
| Module case temperature: Top, Tc,top |
|---|
| Module case temperature: Top, Tc,top |
|---|
| Module case temperature: Bottom, Tc,bot |
|---|
| Module case temperature: Bottom, Tc,bot |
|---|
| LCP surface temperature: Top, TLCP,top |
|---|
| LCP surface temperature: Top, TLCP,top |
|---|
| LCP surface temperature: Bottom, TLCP,bot |
|---|
| LCP surface temperature: Bottom, TLCP,bot |
|---|
| Rth,jc,top = (Tvj - Tc,top)/Ploss,top |
|---|
| Rth,jc,top = (Tvj - Tc,top)/Ploss,top |
|---|
| Rth,jc,bot = (Tvj - Tc,bot)/Ploss,bot |
|---|
| Rth,jc,bot = (Tvj - Tc,bot)/Ploss,bot |
|---|
| Rth,jc = (Rth,jc,top || Rth,jc,bot) |
|---|
| Rth,jc = (Rth,jc,top || Rth,jc,bot) |
|---|
| Rth,TIM,top = (Tc,top - TLCP,top)/Ploss,top |
|---|
| Rth,TIM,top = (Tc,top - TLCP,top)/Ploss,top |
|---|
| Rth,TIM,bot = (Tc,top - TLCP,bot)/Ploss,bot |
|---|
| Rth,TIM,bot = (Tc,top - TLCP,bot)/Ploss,bot |
|---|
| Rth,LCP,top = (TLCP,top – Tf)/Ploss,top |
|---|
| Rth,LCP,top = (TLCP,top – Tf)/Ploss,top |
|---|
| Rth,LCP,bot = (TLCP,bot – Tf)/Ploss,bot |
|---|
| Rth,LCP,bot = (TLCP,bot – Tf)/Ploss,bot |
|---|
| Rth,jf,top = (Tvj – Tf)/Ploss,top |
|---|
| Rth,jf,top = (Tvj – Tf)/Ploss,top |
|---|
| Rth,jf,bot = (Tvj – Tf)/Ploss,bot |
|---|
| Rth,jf,bot = (Tvj – Tf)/Ploss,bot |
|---|
| Rth,jf = (Tvj – Tf)/Ploss |
|---|
| Rth,jf = (Tvj – Tf)/Ploss |
|---|
| Production process |
|---|
| Braze filler melt temperature |
|---|
| Oven internal temperature (CAB) |
|---|
| CAB atmosphere |
|---|
| Layers material |
|---|
| Connectors material |
|---|
| Turbulators material |
|---|
| Lab cooler heatsink material |
|---|
| Lab-setup TIM |
|---|
| Lab-setup TIM thermal conductivity |
|---|
| Lab-setup TIM thickness |
|---|
| Lab-setup clamping force F |
|---|
| Lab-setup fluid |
|---|
| Lab-setup regulated fluid flow rate |
|---|
| Lab-setup controlled fluid temperature |
|---|
| Calibration current |
|---|
| Lab cooler measured Rth,jf @ F=1000 N, 10 L/min |
|---|
| Lab cooler Zth,jf @ t = 1 ms |
|---|
| Lab cooler time to thermal steady-state |
|---|
| BOYD cooler verification module |
|---|
| BOYD cooler TIM stencil thickness |
|---|
| BOYD cooler interface adaptors |
|---|
| BOYD cooler applied clamping force |
|---|
| BOYD cooler tested flow rates |
|---|
| Rth,jf sensitivity to flow rate |
|---|
| BOYD cooler measured Rth,jf @ 10 L/min (avg HS/LS) |
|---|
| Continuous IRMS capability (Module-B, 400V, Rth,jf=0.18 K/W) |
|---|
| Power capability (Module-B, 400V) |
|---|
| Volumetric power density (cooler + module) |
|---|
| BOYD cooler Zth @ t = 1 ms, 10 L/min |
|---|
| BOYD cooler time to steady state |
|---|
| Static/dynamic characterization conditions — Vdc |
|---|
| Rg (SiC) |
|---|
| Vgs (SiC) |
|---|
| Rg (Si) |
|---|
| Vgs (Si) |
|---|
| WLTP simulation — Vdc |
|---|
| WLTP simulation — switching frequency fsw |
|---|
| dv/dt limit (comparison tuning) |
|---|
| SiC average power loss reduction vs Si |
|---|
| Inverter efficiency improvement (SiC vs Si) |
|---|
| WLTP conduction loss reduction (SiC vs Si-IGBT) |
|---|
| WLTP switching loss reduction |
|---|
