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thinksystem-st250-v2 — lenovo-server
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| Form Factor U | 1-Socket (1S) Tower, Convertible to a 5U rack configuration |
|---|---|
| Memory Type | 4x UDIMM slots, up to 128GB, 3200MHz with Xeon E-2300 processors; up to 128GB, 2666MHz with Pentium processors; TruDDR4 ECC memory |
| Cpu Families Supported | Supports single Xeon E2300 Series "Rocket Lake" processor up to 8C / 95W; also Pentium; Intel C256 "Tiger Lake" PCH |
| Cooling | 4 system fans: 2 front for drive bays, 1 rear system fan, 1x CPU fan |
| Psu Count | Choice of 1x fixed power supply or 2x hot-swap; 250W or 300W fixed, or 550W hot-swap |
| Memory Channels Per Cpu | |
| Ocp Slot Count | |
| Drive Controller | |
| Pcie Slot Count | |
| Pcie Generation | |
| Onboard Network | |
| Psu Efficiency | |
| Management Controller | |
| Ashrae Class | |
| Operating System Support | |
| Security Features | |
| Description | |
| Chipset | |
| Motherboard | |
| Packaging Content | |
| Video | |
| System Fans | |
| Dimensions | |
| Ordering Part Numbers | |
| Feature Code | |
| Applications | |
| Backplane Board | |
| Storage | |
| Operating Properties | |
| I O Ports | |
| Power Supply Ac Input | |
| Last Updated | |
| Key Features | |
| Optional Parts | |
| Operating Properties Non Operating | |
| Operating Properties Operating | |
| I O Ports Rear | |
| I O Ports Front | |
| Warranty | |
| Product Name | |
| Storage Front Hot Swap | |
| Product Description | |
| Storage Internal M 2 | |
| Designed By | |
| Tdp | |
| Capacity | |
| Document Type | |
| Note | |
| Storage Note | |
| Power Supply Type | |
| System Fan Features | |
| Max Qty | |
| Product Number | |
| Table | |
| Power Supply Note | |
| Key Feature | |
| Feature | |
| Optical Drive Type | |
| Manufacturer | |
| Accelerators | |
| Included Drives | |
| Product Title | |
| Key Features Power Supply | |
| Rear I O | |
| Front I O | |
| Storage Sas Note | |
| Sed Support | |
| Video Output | |
| Power Cord | |
| Optional Parts 3 Section Rail Kit Supports Cma | |
| Video Port | |
| Clock Speed | |
| Key Features Processors | |
| Backplane I O | |
| Packaging Dimensions | |
| Base Frequency | |
| Ports | |
| Features | |
| Rear I O Ports | |
| Dimension | |
| Rank | |
| Part Numbers | |
| Cas Latency | |
| Application | |
| Storage Rear Hot Swap | |
| Front I O Ports | |
| Internal I O | |
| Part Numbers Power Supply | |
| Key Features M 2 | |
| Modular Gpu | |
| Graphic Vga | |
| Environment Operation Temperature | |
| Environment Non Operation Temperature | |
| Environment Non Operation Humidity | |
| Dimensions Wxhxd | |
| Fans | |
| Target Market | |
| Ac Input | |
| Power Supply Following Different Configuration By Region | |
| Non Operating Humidity | |
| Drive Supported | |
| Key Feature Power Supply | |
| Optional Parts 3 Section Rail Kit | |
| Reference Url | |
| Operating Humidity | |
| Power Supply Power Cord Note | |
| Sas | |
| Product Dimensions Metric | |
| Key Feature Processors | |
| Quantity Supported | |
| Key Features Rom Architecture | |
| Certification | |
| Overview | |
| Bezel | |
| Callout 1 |
| Width (in) | |
|---|---|
| Depth (in) |
| Vendor-specific specifications |
|---|
Every spec value traces to a manufacturer datasheet. Verify against the source before purchase.
