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ThinkSystem ST50 V2 (Lenovo)
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| Product family | ThinkSystem ST50 V2 |
|---|---|
| SKU | 7D8J - 3 YEAR WARRANTY |
| Memory Speed Mt S | 3200 |
|---|---|
| Drive Bay Count | 2 |
| Memory Type | TruDDR4 ECC |
| Server Type | tower |
| Cpu Families Supported | one Intel Xeon E-2300 Series processor ("Rocket Lake") or Intel Pentium ("Comet Lake Refresh") |
| Cooling | air |
| Psu Max Watts | 500 |
| Socket Count | 1 |
| Max Memory Tb | 0.12 |
| Chipset | |
| Description | |
| Drive Controller | |
| Front I O | |
| Management Controller | |
| Onboard Network | |
| Operating System Support |
|---|
| Pcie Generation |
|---|
| Pcie Slot Count |
|---|
| Ports |
|---|
| Product Name |
|---|
| Rear I O |
|---|
| Security Features |
|---|
| Video |
|---|
| Warranty |
|---|
| Xeon processor model series | |
|---|---|
| Xeon max cores | |
| Xeon max core speed | |
| Pentium processor models | |
| Pentium cores | |
| Pentium max core speed | |
| memory slots / type | |
| M.2 drive support | |
| Intel AMT version | |
| UEFI | |
| physical security | |
| power supply efficiency | |
| cooling control | |
| Form Factor | |
| Processor (comparison) | |
| GPU | |
| Memory (comparison) | |
| Storage (comparison) | |
| RAID (comparison) | |
| Cooling (comparison) | |
| Management (comparison) | |
| PCIe Slots (comparison) | |
| Power Supply (comparison) | |
| Form factor | |
| Memory | |
| Memory maximums | |
| Memory protection | |
| Maximum internal storage | |
| Optical drive | |
| Network interfaces | |
| PCI Expansion slots | |
| Audio | |
| Power supply | |
| Operating systems supported | |
| Limited warranty | |
| Service and support | |
| Dimensions - Width | |
| Dimensions - Height | |
| Dimensions - Depth | |
| Weight (maximum) | |
| Ship contents | |
| Machine Type/Model | |
| Intel AMT version (Xeon E models) | |
| Manageability (Pentium models) | |
| AMT/ISM common features | |
| AMT-only feature | |
| KVM redirection requirement | |
| Out-of-band management port | |
| Supported management protocols | |
| Management processor note | |
| Provisioning tool | |
| Electronic security measures | |
| Mechanical security measures | |
| NIST compliance | |
| Intrusion Switch Kit part number | |
| Intrusion Switch Kit feature code | |
| Intrusion Switch Kit description | |
| Hardware Root of Trust / BMC | |
| Optional encrypted disks | |
| Supply chain / trade compliance | |
| Optical mouse part number | |
| Optical mouse description | |
| Keyboard features | |
| Supported keyboards | |
| Integrated video ports | |
| DP to VGA Dongle Kit part number | |
| DP to VGA Dongle Kit description | |
| DP to HDMI Dongle Kit part number | |
| DP to HDMI Dongle Kit description | |
| Native DisplayPort max resolution | |
| DP to VGA dongle max resolution | |
| DP to HDMI dongle max resolution | |
| Form factor / rack space | |
| Rack Mount Kit part number | |
| Rack Mount Kit description | |
| Rail type | |
| Toolless installation | |
| CMA support | |
| Supported rack type | |
| In-rack server maintenance | |
| 1U PDU support | |
| 0U PDU support | |
| Supported mounting holes | |
| Thickness of mounting flanges | |
| Supported distance between front and rear mounting flanges | |
| Rail length | |
| Boot mode support | |
| SATA virtualization mode limitation | |
| ESXi preload - part number (8.0) | |
| ESXi preload - feature code/description (8.0) | |
| ESXi preload - feature code/description (8.0 U1) | |
| ESXi preload configuration rule | |
| Overall width | |
| Overall height | |
| Overall depth | |
| Xa = Width, using widest features (not including feet) | |
| Xb = Width, between the outer edges of the feet | |
| Ya = Height, from bottom of feet to top of chassis body | |
| Yb = Height, from bottom of chassis body to top of chassis body | |
| Za = Depth, from front door to most rearward I/O port surface | |
| Zb = Depth, from front door to deepest feature of the chassis body feature | |
| Zc = Depth, from front door to deepest feature such as power supply handle | |
| Ze = Depth, front door to front plate of chassis body | |
| Shipping (cardboard packaging) width | |
| Shipping (cardboard packaging) height | |
| Shipping (cardboard packaging) depth | |
| Weight, maximum | |
| Electrical input - chassis with 300W power supply, low line | |
| Electrical input - chassis with 300W power supply, high line | |
| Input kilovolt-amperes (kVA), chassis with 300W power supply (maximum configuration) | |
| Electrical input - chassis with 500W power supply, low line | |
| Electrical input - chassis with 500W power supply, high line | |
| Input kilovolt-amperes (kVA), chassis with 500W power supply (maximum configuration) | |
| ASHRAE compliance class | |
| Air temperature, operating (ASHRAE Class A2) | |
| Air temperature, server off | |
| Air temperature, shipment/storage | |
| Maximum altitude | |
| Relative humidity (non-condensing), operating (ASHRAE Class A2) | |
| Relative humidity (non-condensing), shipment/storage | |
| Sound power level (LWAd), idling - typical | |
| Sound power level (LWAd), idling - maximum | |
| Sound power level (LWAd), operating - typical | |
| Sound power level (LWAd), operating - maximum | |
| Sound pressure level (LpAm), idling - typical | |
| Sound pressure level (LpAm), idling - maximum | |
| Sound pressure level (LpAm), operating - typical | |
| Sound pressure level (LpAm), operating - maximum | |
| Acoustic measurement standards | |
| Acoustic typical configuration | |
| Acoustic maximum configuration | |
| Heat/thermal output, minimum configuration | |
| Heat/thermal output, maximum configuration | |
| Vibration, operating | |
| Vibration, non-operating | |
| Shock, operating | |
| Shock, non-operating | |
| Particulate contamination - copper reactivity level | |
| Particulate contamination - silver reactivity level | |
| Particulate contamination - room air filtration | |
| Particulate contamination - data center air filtration | |
| Particulate contamination - deliquescent relative humidity | |
| Particulate contamination - zinc whiskers | |
| Support service levels available |
