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STAMPED BOARD LEVEL HEAT SINK (Boyd)
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| SKU | STAMPED BOARD LEVEL HEAT SINK |
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| Product Name |
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| Fabrication | |
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| Height Range | |
| Material | |
| Finish | |
| Finish | |
| Approx. Thermal Resistance - Natural Convection | |
| Approx. Thermal Resistance - Forced Convection (20LFM – 1000LFM) |
| Heat Sink-to-Board Mounting Methods |
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| Heat Sink-to-Board Mounting Methods |
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| Heat Sink-to-Board Mounting Methods |
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| Heat Sink-to-Board Mounting Methods |
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| Heat Sink-to-Board Mounting Methods |
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| Heat Sink-to-Board Mounting Methods |
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| Dissipating Component Mounting to Device |
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| Dissipating Component Mounting to Device |
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| Dissipating Component Mounting to Device |
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| Ideal Power Application |
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| Trade Offs & Limitations |
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| Trade Offs & Limitations |
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| Trade Offs & Limitations |
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| Benefit |
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| Benefit |
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| Benefit |
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| Benefit |
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