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7D32 - 3-YEAR WARRANTY (Lenovo)
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| Memory Speed Mt S | 3200 |
|---|---|
| Drive Bay Count | 24 |
| Max Memory Tb | 12 |
| Form Factor U | 2 |
| Server Type | rack_server |
| Max Gpu Count | 2 |
| Cpu Families Supported | Two or four third-generation Intel Xeon Scalable processors, either Gold or Platinum level processors (formerly codename "Cooper Lake" or CPX6). Supports processors up to 28 cores, core speeds up to 3.9 GHz, and TDP ratings up to 250W. Two processor sockets on the system board and two processors on the Processor and Memory Expansion Tray. Six Intel Ultra Path Interconnect (UPI) links at 10.4 GT/s each. Four processors are connected in a mesh topology. |
| Cooling | air |
| Psu Max Watts | 2400 |
| Memory Module Types | RDIMMs and 3DS RDIMMs; UDIMMs and LRDIMMs are not supported |
| Memory Type | Lenovo TruDDR4 memory |
| Ashrae Class | |
| Chipset | |
| Dimensions | |
| Drive Controller | |
| Management Controller | |
| Operating System Support |
| Pcie Generation |
|---|
| Ports |
|---|
| Product Name |
|---|
| Security Features |
|---|
| Video |
|---|
| Warranty |
|---|
| Height (in) | 3.4252 |
|---|---|
| Weight (lb) | 88.1849 |
| Depth (in) | |
| Width (in) |
| SKU | 7D32 - 3-YEAR WARRANTY |
|---|
| Processor cores (max) | |
|---|---|
| Processor core speed (max) | |
| Processor TDP (max) | |
| UPI links | |
| Memory | |
| DIMM slots (max) | |
| Persistent memory | |
| Memory maximum (system DIMMs) | |
| Memory maximum (Persistent Memory AppDirect) | |
| Memory maximums note | |
| Memory protection | |
| Maximum internal storage (SAS/SATA SSD) | |
| Maximum internal storage (NVMe SSD) | |
| Maximum internal storage (HDD) | |
| Optical drive bays | |
| Tape drive bays | |
| Network interfaces | |
| PCI Expansion slots | |
| Power supply | |
| Hot-swap parts | |
| Operating systems supported | |
| Limited warranty | |
| Service and support | |
| Dimensions - Width | |
| Dimensions - Height | |
| Dimensions - Depth | |
| Weight (maximum) | |
| Shipped items | |
| Width (overall, excluding components extending outside chassis) | |
| Height (overall, excluding components extending outside chassis) | |
| Depth (overall, excluding components extending outside chassis) | |
| Xa = Width, to the outsides of the front EIA flanges | |
| Xb = Width, to the rack rail mating surfaces | |
| Xc = Width, to the outer most chassis body feature | |
| Ya = Height, from the bottom of chassis to the top of the chassis | |
| Za = Depth, from the rack flange mating surface to the rearmost I/O port surface | |
| Zb = Depth, from the rack flange mating surface to the rearmost feature of the chassis body | |
| Zc = Depth, from the rack flange mating surface to the rearmost feature such as power supply handle | |
| Zd = Depth, from the forwardmost feature on front of EIA flange to the rack flange mating surface | |
| Ze = Depth, from the front of security bezel (if applicable) or forwardmost feature to the rack flange mating surface | |
| Shipping (cardboard packaging) width | |
| Shipping (cardboard packaging) height | |
| Shipping (cardboard packaging) depth | |
| Weight, minimum configuration | |
| Weight, maximum configuration | |
| Input voltage | |
| Inlet current, 100-127 V, 750W Titanium power supply | |
| Inlet current, 100-127 V, 1100W power supply | |
| Inlet current, 100-127 V, 1800W power supply | |
| Inlet current, 100-127 V, 2400W power supply | |
| Inlet current, 200-240 V, 750W Titanium power supply | |
| Inlet current, 200-240 V, 1100W power supply | |
| Inlet current, 200-240 V, 1800W power supply | |
| Inlet current, 200-240 V, 2400W power supply | |
| Air temperature, Operating ASHRAE Class A2 | |
| Air temperature, Operating ASHRAE Class A3 | |
| Air temperature, Operating ASHRAE Class A4 | |
| Air temperature, Server off | |
| Air temperature, Shipment/storage | |
| Maximum altitude | |
| Relative Humidity (non-condensing), Operating ASHRAE Class A2 | |
| Relative Humidity (non-condensing), Operating ASHRAE Class A3 | |
| Relative Humidity (non-condensing), Operating ASHRAE Class A4 | |
| Relative Humidity (non-condensing), Shipment/storage | |
| Ambient temperature requirement (specific components installed) | |
| Ambient temperature requirement (persistent memory) | |
| ASHRAE A3/A4 hardware configuration requirements | |
| Acoustic - Sound power level (LWAd), Idling, Typical configuration | |
| Acoustic - Sound power level (LWAd), Idling, GPU configuration | |
| Acoustic - Sound power level (LWAd), Idling, Rich configuration | |
| Acoustic - Sound power level (LWAd), Operating, Typical configuration | |
| Acoustic - Sound power level (LWAd), Operating, GPU configuration | |
| Acoustic - Sound power level (LWAd), Operating, Rich configuration | |
| Acoustic - Sound pressure level (LpAm), Idling, Typical configuration | |
| Acoustic - Sound pressure level (LpAm), Idling, GPU configuration | |
| Acoustic - Sound pressure level (LpAm), Idling, Rich configuration | |
| Acoustic - Sound pressure level (LpAm), Operating, Typical configuration | |
| Acoustic - Sound pressure level (LpAm), Operating, GPU configuration | |
| Acoustic - Sound pressure level (LpAm), Operating, Rich configuration | |
| Acoustic - Typical configuration definition | |
| Acoustic - GPU configuration definition | |
| Acoustic - Rich configuration definition | |
| Acoustic measurement standard | |
| Vibration, Operating | |
| Vibration, Non-operating | |
| Shock, Operating | |
| Shock, Non-operating (23 kg - 31 kg) | |
| Shock, Non-operating (32 kg - 68 kg) | |
| Particulate contamination - Reactive gases (copper) | |
| Particulate contamination - Reactive gases (silver) | |
| Particulate contamination - Airborne particulates (room air) | |
| Particulate contamination - Airborne particulates (data center) | |
| Particulate contamination - Deliquescent relative humidity | |
| Particulate contamination - Zinc whiskers | |
| Machine types | |
| Memory maximums | |
| Maximum internal storage | |
| DIMMs per processor | |
| Maximum DIMMs (four processors) | |
| Memory channels per processor | |
| DIMMs per channel | |
| Maximum system memory (4-socket, 256GB 3DS RDIMMs) | |
| Persistent memory support | |
| Maximum memory speed (2 DIMMs per channel) | |
| Memory speed dependency | |
| Memory option RDIMM - ThinkSystem 16GB TruDDR4 3200MHz (2Rx8 1.2V) RDIMM | |
| Memory option RDIMM - ThinkSystem 32GB TruDDR4 3200MHz (2Rx4 1.2V) RDIMM | |
| Memory option RDIMM - ThinkSystem 32GB TruDDR4 3200MHz (2Rx8 1.2V) RDIMM | |
| Memory option RDIMM - ThinkSystem 64GB TruDDR4 3200MHz (2Rx4 1.2V) RDIMM | |
| Memory option 3DS RDIMM - ThinkSystem 128GB TruDDR4 3200 MHz (2S2Rx4 1.2V) 3DS RDIMM | |
| Memory option 3DS RDIMM - ThinkSystem 256GB TruDDR4 2933MHz (8Rx4 1.2V) 3DS RDIMM | |
| Supported DIMM quantities (16GB and 256GB DIMMs) | |
| Supported DIMM quantities (32GB, 64GB and 128GB DIMMs) | |
| Mixing RDIMMs and 3DS RDIMMs | |
| Mixing 128GB and 256GB 3DS RDIMMs | |
| Mixing x4 and x8 DIMMs | |
| Front drive bays limit with 128GB or 256GB 3DS DIMMs | |
| Front drive bays limit with 256GB 3DS DIMMs | |
| Memory protection technologies supported | |
| Memory mirroring OS-available capacity | |
| Persistent memory option - ThinkSystem 128GB TruDDR4 3200MHz (1.2V) Intel Optane Persistent Memory | |
| Persistent memory option - ThinkSystem 256GB TruDDR4 3200MHz (1.2V) Intel Optane Persistent Memory | |
| Persistent memory option - ThinkSystem 512GB TruDDR4 3200MHz (1.2V) Intel Optane Persistent Memory | |
| PMem supported modes | |
| PMem operating speed | |
| PMem mixing capacities | |
| Maximum PMem modules per processor | |
| PMem and DIMM channel slot placement | |
| PMem interleaving modes | |
| Memory mirroring with PMem | |
| PMem ambient temperature limit | |
| PMem supported operating systems | |
| App Direct Mode RDIMM:PMem ratio requirement | |
| 16GB DIMMs in App Direct Mode | |
| App Direct combination (960 GB per processor) | |
| App Direct combination (1.125 TB per processor) | |
| App Direct combination (1.5 TB per processor) | |
| App Direct combination (1.875 TB per processor) | |
| App Direct combination (2.25 TB per processor) | |
| App Direct combination (3 TB per processor) | |
| App Direct combination (3.75 TB per processor) | |
| App Direct combination (4.5 TB per processor) | |
| PMem actual user capacity note | |
| App Direct mode ratio note | |
| PMem memory protection technologies | |
| Slot 1 (PCIe layout, without 2-slot riser) | |
| Slot 1 (PCIe layout, with 2-slot riser) | |
| Slot 2 (PCIe layout, without 2-slot riser) | |
| Slot 2 (PCIe layout, with 2-slot riser) | |
| Slot 3 (PCIe layout) | |
| Slot 4 (PCIe layout) | |
| Slot 5 (PCIe layout) | |
| Slot 6 (PCIe layout) | |
| Slot 7 (PCIe layout) | |
| Slot 8 (PCIe layout) | |
| Slot configuration without 7mm drive bays | |
| Slot configuration with 7mm drive bays | |
| 7mm drive bay slot conflict (footnote **) | |
| Riser 1 (Zone 1) implements slots | |
| Riser 1 option - 3-slot riser (feature BAW7) | |
| 3-slot riser (BAW7) - Slot 1 | |
| 3-slot riser (BAW7) - Slot 2 | |
| 3-slot riser (BAW7) - Slot 3 | |
| Riser 1 option - 2-slot riser (feature BAW6) | |
| 2-slot riser (BAW6) - Slot 1 | |
| 2-slot riser (BAW6) - Slot 2 | |
| Riser 2 (Zone 2) implements slots | |
| Riser 2 option - 2-slot riser (feature BCPF) | |
| Riser 2 (BCPF) - Slot 5 | |
| Riser 2 (BCPF) - Slot 6 | |
| Riser 2 CPU requirement | |
| PCI riser card option (Riser 1) - BAW6 | |
| PCI riser card option (Riser 1) - Upgrade only | |
| PCI riser card option (Riser 1) - BAW7 | |
| PCI riser card option (Riser 2, four processors required) - BCPF | |
| Table 36 footnote (*) | |
| Cooling - fan configuration | |
| Cooling - fan redundancy | |
| Cooling - power supply / riser fans | |
| Power supplies - max quantity / redundancy | |
| Power supply options + LEDs + power cords | |
| Rack installation option | |
| Rail kit | |
| Rail kit part number | |
| Rail type | |
| Toolless installation | |
| Cable Management Arm (CMA) support | |
| In-rack server maintenance | |
| 1U PDU support | |
| 0U PDU support | |
| Rack type | |
| Mounting holes | |
| Mounting flange thickness | |
| Distance between front and rear mounting flanges | |
| Rail length*** | |
| Rail travel length | |
| Operating system support note | |
| Operating System Interoperability Guide | |
| VMware ESXi preload | |
| ESXi preload configuration rule | |
| Shipping (cardboard packaging) Width | |
| Shipping (cardboard packaging) Height | |
| Shipping (cardboard packaging) Depth | |
| Air temperature, Operating, ASHRAE Class A2 | |
| Air temperature, Operating, ASHRAE Class A3 | |
| Air temperature, Operating, ASHRAE Class A4 | |
| Relative Humidity (non-condensing), Operating, ASHRAE Class A2 | |
| Relative Humidity (non-condensing), Operating, ASHRAE Class A3 | |
| Relative Humidity (non-condensing), Operating, ASHRAE Class A4 | |
| Ambient temperature requirement, 165W < TDP ≤ 205W processors or DRAM DIMMs > 64 GB | |
| Ambient temperature requirement, TDP > 205W processors or NVIDIA T4 GPUs | |
| Ambient temperature requirement, persistent memory installed | |
| Sound power level (LWAd), Idling, Typical configuration | |
| Sound power level (LWAd), Idling, GPU configuration | |
| Sound power level (LWAd), Idling, Rich configuration | |
| Sound power level (LWAd), Operating, Typical configuration | |
| Sound power level (LWAd), Operating, GPU configuration | |
| Sound power level (LWAd), Operating, Rich configuration | |
| Sound pressure level (LpAm), Idling, Typical configuration | |
| Sound pressure level (LpAm), Idling, GPU configuration | |
| Sound pressure level (LpAm), Idling, Rich configuration | |
| Sound pressure level (LpAm), Operating, Typical configuration | |
| Sound pressure level (LpAm), Operating, GPU configuration | |
| Sound pressure level (LpAm), Operating, Rich configuration | |
| Acoustic Typical configuration definition | |
| Acoustic GPU configuration definition | |
| Acoustic Rich configuration definition | |
| Shock, Non-operating, 23 kg - 31 kg | |
| Shock, Non-operating, 32 kg - 68 kg | |
| Particulate contamination, Reactive gases, copper reactivity level | |
| Particulate contamination, Reactive gases, silver reactivity level | |
| Particulate contamination, Airborne particulates, room air filtration | |
| Particulate contamination, Airborne particulates, data center air filtration | |
| Particulate contamination, deliquescent relative humidity | |
| Particulate contamination, zinc whiskers |
