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7D1J - 3 YEAR WARRANTY (Lenovo)
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| Form Factor U | 2 |
|---|---|
| Server Type | rack_server |
| Cooling | air |
| Psu Max Watts | 2600 |
| Dimensions | |
| Ports | |
| Product Name |
| SKU | 7D1J - 3 YEAR WARRANTY |
|---|
| Server support | |
|---|---|
| Servers per 42U rack | |
| Midplane | |
| System Management Module | |
| I/O architecture |
| Power supplies |
|---|
| Power cords |
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| Enclosure LEDs |
|---|
| Hot-swap parts |
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| Limited warranty |
|---|
| Servers per 48U rack |
|---|
| Nodes per DA240 enclosure |
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| SD630 V2 node width |
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| SD630 V2 node height |
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| SD630 V2 node depth |
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| SD630 V2 node depth including internal connector at rear |
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| DA240 enclosure overall width |
|---|
| DA240 enclosure overall height |
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| DA240 enclosure overall depth |
|---|
| Xa = Width, to the outsides of the front EIA flanges |
|---|
| Xb = Width, to the rack rail mating surfaces |
|---|
| Xc = Width, to the outer most chassis body feature |
|---|
| Ya = Height, from the bottom of chassis to the top of the chassis |
|---|
| Za = Depth, from the rack flange mating surface to the rearmost I/O port surface |
|---|
| Zb = Depth, from the rack flange mating surface to the rearmost feature of the chassis body |
|---|
| Zc = Depth, from the rack flange mating surface to the rearmost feature such as power supply handle (1800W PSU) |
|---|
| Zc = Depth, from the rack flange mating surface to the rearmost feature such as power supply handle (2400W PSU) |
|---|
| Zd = Depth, from the forwardmost feature on front of EIA flange to the rack flange mating surface |
|---|
| Ze = Depth, from the front of security bezel (if applicable) or forwardmost feature to the rack flange mating surface |
|---|
| Server dimensions figure |
|---|
| SD630 V2 shipping (cardboard packaging) width |
|---|
| SD630 V2 shipping (cardboard packaging) height |
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| SD630 V2 shipping (cardboard packaging) depth |
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| DA240 shipping (cardboard packaging) width |
|---|
| DA240 shipping (cardboard packaging) height |
|---|
| DA240 shipping (cardboard packaging) depth |
|---|
| SD630 V2 weight minimum |
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| SD630 V2 weight maximum |
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| DA240 enclosure weight minimum (with one node) |
|---|
| DA240 enclosure weight maximum (with four nodes) |
|---|
| Input voltage (nominal) |
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| Input frequency |
|---|
| Input voltage DC (China only) |
|---|
| Inlet current (1800W power supply) |
|---|
| Inlet current (2400W power supply) |
|---|
| ASHRAE compliance class |
|---|
| Performance impact temperature threshold (TDP 165 watts or lower) |
|---|
| Performance impact temperature threshold (TDP higher than 165 watts) |
|---|
| Processor noted for performance impact above 25°C |
|---|
| Air temperature, power on (ASHRAE Class A2) |
|---|
| Air temperature de-rating above 900 m |
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| Air temperature, power off (removed from shipping container) |
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| Maximum altitude |
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| Relative Humidity (non-condensing), power on - ASHRAE Class A2 |
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| Relative Humidity (non-condensing), shipment/storage |
|---|
| Sound power level (LWAd) Idling Typical config |
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| Sound power level (LWAd) Idling Max config |
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| Sound power level (LWAd) Operating Typical config |
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| Sound power level (LWAd) Operating Max config |
|---|
| Sound pressure level (LpAm) Idling Typical config |
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| Sound pressure level (LpAm) Idling Max config |
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| Sound pressure level (LpAm) Operating Typical config |
|---|
| Sound pressure level (LpAm) Operating Max config |
|---|
| Acoustic measurement standards |
|---|
| Acoustic typical configuration |
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| Acoustic max configuration |
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| Heat output minimum configuration (with one minimal configuration node) |
|---|
| Heat output maximum configuration (with four maximal configuration nodes) |
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| Vibration operating |
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| Vibration non-operating |
|---|
| Shock operating |
|---|
| Shock non-operating (4 kg - 11 kg) |
|---|
| Particulate contamination - copper reactivity level |
|---|
| Particulate contamination - silver reactivity level |
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| Particulate contamination - room air filtration |
|---|
| Particulate contamination - data center air filtration |
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| Particulate contamination - deliquescent relative humidity |
|---|
| Particulate contamination - zinc whiskers |
|---|
| Service and support |
|---|
| Ambient temperature |
|---|
| Weight (minimum, with one node) |
|---|
| Weight (maximum, with four nodes) |
|---|
| Base CTO model - General purpose (Machine Type/Model) |
|---|
| Base CTO model - HPC and AI (Machine Type/Model) |
|---|
| Base for CTO models - Feature code |
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| Shipping bracket feature code |
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| Power supply redundancy |
|---|
| Power supply option |
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| Power supply option - Connector |
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| Power supply option - Quantity supported |
|---|
| Power supply option - ERP lot 9 |
|---|
| Power supply option - 110V AC |
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| Power supply option - 220V AC |
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| Power supply option - 240V DC China only |
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| Power supply line cord note |
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| Power cord (C13) |
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| Power cord (C19) |
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| Fan quantity (TDP ≤ 165W) |
|---|
| Fan quantity (TDP > 165W) |
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| Power supply integrated fan |
|---|
| Fan ordering option |
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| Enclosure node capacity |
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| Enclosure overall width |
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| Enclosure overall height |
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| Enclosure overall depth |
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| Detailed dimension Xa (Width, to the outsides of the front EIA flanges) |
|---|
| Detailed dimension Xb (Width, to the rack rail mating surfaces) |
|---|
| Detailed dimension Xc (Width, to the outer most chassis body feature) |
|---|
| Detailed dimension Ya (Height, from the bottom of chassis to the top of the chassis) |
|---|
| Detailed dimension Za (Depth, from the rack flange mating surface to the rearmost I/O port surface) |
|---|
| Detailed dimension Zb (Depth, from the rack flange mating surface to the rearmost feature of the chassis body) |
|---|
| Detailed dimension Zc (Depth, from the rack flange mating surface to the rearmost feature such as power supply handle) |
|---|
| Detailed dimension Zd (Depth, from the forwardmost feature on front of EIA flange to the rack flange mating surface) |
|---|
| Detailed dimension Ze (Depth, from the front of security bezel (if applicable) or forwardmost feature to the rack flange mating surface) |
|---|
| Enclosure shipping width (cardboard packaging) |
|---|
| Enclosure shipping height (cardboard packaging) |
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| Enclosure shipping depth (cardboard packaging) |
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| Enclosure weight minimum (with one node) |
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| Enclosure weight maximum (with four nodes) |
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| Input voltage |
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